Grade 758 (Clear Liquid)

        UV Cure Only

        High Temperature

        Low Viscosity

        Shallow Potting

        
Ultrabond 758 is a fast fixturing, general purpose, shallow
        potting compound with gap filling capabilities to .100 inch.
        In assembly line applications the low viscosity promotes rapid
        self leveling and excellent penetration. Thermal integrity is
        350 degrees Fahrenheit.

        
Use 758 for shallow potting and encapsulation on assembly
        line applications.

        
Comparison Chart

        
Ultrabond Description