Thermally Conductive Adhesives are often used to bond heat sinks or encapsulate sensors. They provide a fast bond that does not insulate heat in the way most other adhesives will. Manufacturers can select specific capabilities of thermal transfer with the coefficient of thermal conductivity or “K factor” maxing out at 0.808 for Dissipator® 745. More formulas are available with higher conductivity via the Hernon Manufacturing custom formula development program that designs new adhesives for specific manufacturing operations.
While conducting heat, the Hernon Manufacturing Dissipator® brand adhesives also insulate against electric currents- reducing the risk of shorting components or misrouting power. Thermally conductive adhesives are also used for potting components to ensure an even heat distribution and other applications including fabrication of printed circuit boards, adhering LEDs and bonding materials with different thermal expansion rates.
View Hernon Manufacturing Thermally Conductive Adhesives.
Popular Thermally Conductive Adhesives
VIEW HERNON MANUFACTURING THERMALLY CONDUCTIVE ADHESIVES
- Dissipator® 745: (0.808 W/m*K) A thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
- Dissipator® 746: (0.76 W/m*K) A thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards.