How To by Hernon: Guide to Temperature Resistance
Guide to Temperature Resistance By Hernon Manufacturing
Changes in temperature alter the physical properties of all materials including adhesives. To make sure your adhesive solution will maintain its bond under temperature changes, write down the coldest and warmest temperatures you expect your product to face and ask your adhesive supplier to match that temperature range. Be sure to discuss how quickly these temperature extremes will be reached. Moving from one extreme temperature to the other and back is called temperature cycling and such changes create stress on a material. The faster the cycling, the greater the stress. Some adhesives which offer excellent temperature resistance at one extreme can crack or fail during the cycling process so be sure to consider the adhesive’s tolerance of temperature change and not just the maximum or minimum operating temperature.
In some situations, you may want to see if an adhesive can multitask to help solve secondary issues. For example: in electronics manufacturing, significant heat can build up and it is common practice to attach a heat sink to help dissipate the energy. Some adhesives are known to be heat conductive and can not only withstand high temperatures, but be used to transfer heat away from heat sources and heat sensitive areas as well. Often heat sinks will be attached using a heat dissipating adhesive solving both the issue of attaching the heat sink component and improving heat transference. One product offering this heat dissipating capability is Dissipator® 745 from Hernon Manufacturing.
Extreme cold can be just as difficult to deal with as extreme heat. Hernon® adhesives experts have encountered this challenge from customers in the cryogenics industry. One of the best solutions available is Dripstop® 950. This product is an adhesive and thread sealant able to withstand exposure to liquid nitrogen and still maintain its bond. Dripstop® 950 seals up to 10,000 PSI, is odorless, non-corrosive and hydrophobic. It is totally non-migrating and remains where it is applied. It is ideal for use in repetitive assembly and applications where disassembly is required, even after long periods of time.