Tuffbond® 308

PRODUCT DESCRIPTION

Tuffbond® 308 is a specially formulated, low chlorine, single component epoxy system which cures at temperatures of 212ºF (100ºC) and above. Tuffbond® 308 is suitable for potting and encapsulation of electrical and electronic components. It has excellent storage stability and produces tough, flexible bonds with superior shear strengths when used on metals, ceramics, and many plastics. Optimum strength can be obtained after ten to fifteen minutes cure at 300ºF (149ºC).

Product Benefits:
• Low chlorine content
• Excellent adhesion
• One part – no mixing
• Good mechanical properties
• Tough, flexible bonds
• Suitable for potting electronic boards and encapsulating electrical and electronic components

Grade: 308

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