Tuffbond® 322

PRODUCT DESCRIPTION

Tuffbond® 322 is a transparent 1:1 flexible, low viscosity, general-purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Typical Applications

  • Potting electronic boards
  • Potting battery components
  • Encapsulating electrical and electronic components
  • Transformers
  • Coils and chokes
  • Solenoids
  • Micro circuitry

Product Benefits

  • Low viscosity
  • Low shrinkage
  • Room temperature or heat curing
  • Can be used on metals, PVC, phenolics
Grade: 322

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