Tuffbond® 65891


Tuffbond® 65891 is a two-component, room temperature cure system. Tuffbond® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.

Typical Applications:
• Tank lining
• Chemical resistant flooring
• Marine coating
• Underwater coating
• Potting electronic boards
• Encapsulating electrical and electronic components

Product Benefits:
• Excellent resistance to organic acids and bases
• Good mechanical properties
• Good water resistance
• Outstanding resistance to abrasion
• Low-temperature cure – Non-critical mixing

Grade: 65891


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