Hernon Tuffbond 67011 adhesive/sealant is a two component, 100% solid system, two to one ratio, room temperature cure system. Tuffbond 67011 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
• Potting electronic boards
• Encapsulating electrical and electronic components
• Marine coating
• Underwater coating
• Excellent resistance to organic acids and bases.
• Good mechanical properties.
• Outstanding resistance to abrasion.
• Non-critical mixing.
Aerospace, aviation, automotive, electrical, electronics, appliance, defense, ammunition, marine, engineered plastics, heavy equipment, maintenance, energy and utilities, industrial assemblies, medical device assemblies, composites.