Product Detail

Advanced Adhesives and Product Details

Our technical specifications, similar products and dispensing equipment for this product are listed below. If you have still have questions about the technical characteristics of this product, Hernon Manufacturing gives you the unique opportunity to talk to one of our product engineers. You can also print out a convenient, easy-to-share product package by clicking on the link "Print Product Presentation."

Tuffbond 322

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Detail/Description

Product Description
Hernon® Tuffbond® 322 is a transparent 1:1 flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Typical Applications
• Potting electronic boards
• Potting battery components
• Encapsulating electrical and electronic components
• Transformers
• Coils and chokes
• Solenoids
• Micro circuitry

Product Benefits
• Low viscosity
• Low shrinkage
• Room temperature or heat curing
• Can be used on metals, PVC, phenolics

Dispensing Equipment:

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