Product Detail

Advanced Adhesives and Product Details

Our technical specifications, similar products and dispensing equipment for this product are listed below. If you have still have questions about the technical characteristics of this product, Hernon Manufacturing gives you the unique opportunity to talk to one of our product engineers. You can also print out a convenient, easy-to-share product package by clicking on the link "Print Product Presentation."

Tuffbond 65891

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Detail/Description

Product Description
Hernon® Tuffbond® 65891 is a two component, room temperature cure system. Tuffbond® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic
components.

Typical Applications

• Tank lining
• Chemical resistant flooring
• Marine coating
• Underwater coating
• Potting electronic boards
• Encapsulating electrical and electronic components

Product Benefits
• Excellent resistance to organic acids and bases
• Good mechanical properties
• Good water resistance
• Outstanding resistance to abrasion
• Low temperature cure – Non-critical mixing

Dispensing Equipment:

Similar Products: