Product Detail

Advanced Adhesives and Product Details

Our technical specifications, similar products and dispensing equipment for this product are listed below. If you have still have questions about the technical characteristics of this product, Hernon Manufacturing gives you the unique opportunity to talk to one of our product engineers. You can also print out a convenient, easy-to-share product package by clicking on the link "Print Product Presentation."

Tuffbond 321

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Detail/Description

Product Description
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique flexible epoxy has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties. Excellent for use as a potting epoxy.

Typical Applications
  • Potting electronic boards
  • Encapsulating electrical and electronic components
  • Transformers
  • Coils and chokes
  • Solenoids
  • Micro circuitry

Product Benefits
  • Low viscosity
  • Clear
  • Room temperature or heat curing
  • Flexible epoxy

INDUSTRIES SERVED
Aerospace, aviation, automotive, electrical, electronics, appliance, defense, ammunition, marine, engineered plastics, heavy equipment, maintenance, energy and utilities, industrial assemblies, medical device assemblies, composites