Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties. Typical Applications • Potting electronic boards • Encapsulating electrical and electronic components • Transformers • Coils and chokes • Solenoids • Micro circuitry Product Benefits • Low viscosity • Clear and flexible • Room temperature or heat curing

Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.

Silastomer® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a form in place gasket. It will adhere to clean metals, glass, most types of wood, silicone resin, vulcanized silicone rubber, natural and synthetic fiber, ceramic, many plastics and painted surfaces. Silastomer® 343 provides excellent resistance to moisture, weathering, vibration, ozone and extreme temperatures. It can be applied in surface temperatures of 0°F to above 120°F with no loss in performance. Fully cured Silastomer® 343 can withstand extended periods at temperatures up to 400°F.

Ultrabond® Sealant 721 is a UV curable adhesive that can be used to seal a variety of plastics when exposed to UV light. The sealant offers a water- tight seal with excellent environmental resistance. Prevents material escaping through a crimped seal. With Ultrabond® Sealant 721 a low powered UV lamp (Blacklight), can be used to inspect for the presence of adhesive on the substrates.

Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 302 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.

Hernon® Tuffbond® 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 397 will change from amber-yellow to a reddish brown upon cure. Product Benefits • High temperature resistance. • Single component (no mixing, no pot life). • Contains 150micron spacer beads for bond line control • Solventless. • Cures on demand (heat cure). • Will not slip during cure. • Changes color upon cure (yellow to brown). • Excellent adhesion to various substrates. • Gives high shear. • Low water absorption.