Tuffbond® 321

Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties. Typical Applications • Potting electronic boards • Encapsulating electrical and electronic components • Transformers • Coils and chokes • Solenoids • Micro circuitry Product Benefits • Low viscosity • Clear and flexible • Room temperature or heat curing