Thermally Conductive Adhesives for Demanding Applications
Efficient heat management is essential in modern electronics, automotive systems, and industrial equipment. Hernon’s thermally conductive adhesives are expertly formulated to transfer heat away from sensitive components while maintaining strong structural bonds. These advanced thermal compounds for manufacturing are ideal for bonding heat sinks, power modules, PCBs, lighting systems, and more.
Designed to meet the rigorous demands of high-performance assemblies, Hernon’s thermal adhesives offer excellent thermal conductivity, electrical insulation, and long-term durability—even under harsh operating conditions.
Whether you’re looking to improve cooling efficiency, reduce thermal resistance, or streamline production, Hernon delivers trusted solutions for thermal management in manufacturing environments.
Key Benefits:
High thermal conductivity for efficient heat dissipation
Strong mechanical bonds with minimal thermal resistance
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips.
Typical Applications
Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
Product Benefits
• No mixing required (eliminates errors in mixing ratio)
• Room temperature cure. No heat required.
• Eliminates screws and rivets for assembly.
• Eliminates the air space between components.
• High k factor for heat conductive application