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Thermally Conductive

Thermally Conductive Adhesives Specially Formulated for Efficient Heat Conduction

Thermally conductive adhesives are essential for bonding heat sinks, encapsulating sensors, and various other applications where efficient heat transfer is critical. Unlike traditional adhesives that insulate heat, heat conductive adhesives are specially formulated to conduct heat effectively while providing a fast bond. The coefficient of thermal conductivity (or "K factor") of Hernon Manufacturing's Dissipator® 745 maxes out at 0.808, with additional formulas available for even higher conductivity through the custom formula development program.

These thermally conductive adhesives not only excel at heat conduction but also insulate electrically, reducing the risk of shorting components or misrouting power. They are ideal for potting components, ensuring even heat distribution, and applications like printed circuit board fabrication, LED adhesion, and bonding materials with different thermal expansion rates.

Significant Features and Key Advantages of Hernon Manufacturing Thermally Conductive Adhesives:

Heat conductive adhesives that efficiently transfers heat across the bond
Reduces cost and time compared to alternative fastening methods
Diffuses stress across the entire bonded surface
Bonds with lightweight polymers for easy application
100% active – no solvents
Resistant to vibrations and impacts
Provides electrical insulation
Seals and fills gaps
Strong thermal cycling tolerance
Apply across the entire bonding surface in one simple step

Experience the power of thermally conductive adhesive solutions for your next high-performance application.

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Dissipator 319

Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Dissipator® 319 features good thermal conductivity (1.1 W/mK to 1.4 W/mK)

Dissipator® 745

Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.

DISSIPATOR 745D

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application

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