Thermally Conductive
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Thermally Conductive Adhesives Specially Formulated for Efficient Heat Conduction
Thermally conductive adhesives are essential for bonding heat sinks, encapsulating sensors, and various other applications where efficient heat transfer is critical. Unlike traditional adhesives that insulate heat, heat conductive adhesives are specially formulated to conduct heat effectively while providing a fast bond. The coefficient of thermal conductivity (or "K factor") of Hernon Manufacturing's Dissipator® 745 maxes out at 0.808, with additional formulas available for even higher conductivity through the custom formula development program.
These thermally conductive adhesives not only excel at heat conduction but also insulate electrically, reducing the risk of shorting components or misrouting power. They are ideal for potting components, ensuring even heat distribution, and applications like printed circuit board fabrication, LED adhesion, and bonding materials with different thermal expansion rates.
Significant Features and Key Advantages of Hernon Manufacturing Thermally Conductive Adhesives:
- Heat conductive adhesives that efficiently transfers heat across the bond
- Reduces cost and time compared to alternative fastening methods
- Diffuses stress across the entire bonded surface
- Bonds with lightweight polymers for easy application
- 100% active – no solvents
- Resistant to vibrations and impacts
- Provides electrical insulation
- Seals and fills gaps
- Strong thermal cycling tolerance
- Apply across the entire bonding surface in one simple step
Experience the power of thermally conductive adhesive solutions for your next high-performance application.
DISSIPATOR 745D
