- Reduced cost and time per application over alternative fastening methods
- Conduct heat through an adhesive bond
- Diffuses stress across the entire bonded surface
- Bonds using lightweight polymers
- 100% Active – No Solvents
- Resistant to Vibrations and Impacts
- Insulates electrically
- Seal and fills gaps
- Strong thermal cycling tolerance
- Apply across the entire bonding surface in one step
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Thermally Conductive
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Thermally Conductive Adhesives Specially Formulated for Efficient Heat Conduction
Thermally Conductive Adhesives are often used to bond heat sinks or encapsulate sensors. They provide a fast bond that does not insulate heat in the way most other adhesives will. Manufacturers can select specific capabilities of thermal transfer with the coefficient of thermal conductivity or “K factor” maxing out at 0.808 for Dissipator® 745. More formulas are available with higher conductivity via the Hernon Manufacturing custom formula development program that designs new adhesives for specific manufacturing operations.
While conducting heat, Hernon Manufacturing Dissipator® brand adhesives also insulate against electric currents- reducing the risk of shorting components or misrouting power. Thermally conductive adhesives are also used for potting components to ensure an even heat distribution and other applications including the fabrication of printed circuit boards, adhering LEDs, and bonding materials with different thermal expansion rates.
Significant Features and Key Advantages of Hernon Manufacturing Thermally Conductive Adhesives:
Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Dissipator® 319 features good thermal conductivity (1.1 W/mK to 1.4 W/mK)
DISSIPATOR 745D
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
Product Benefits
• No mixing required (eliminates errors in mixing ratio)
• Room temperature cure. No heat required.
• Eliminates screws and rivets for assembly.
• Eliminates the air space between components.
• High k factor for heat conductive application
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