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Quantum® 150 UV is a single component, solventless, room temperature curing cyanoacrylate adhesive with light curing property. The presence of surface moisture and/or light (UV or Visible light) commence the cure of the adhesive.
Quantum® 150 UV develops handling strength within
seconds and full functional strength within minutes.
Quantum 150 UV can bond a wide variety of surfaces
including thermoplastics, elastomers.
Product Benefits:
• Rapid Cure: forms a strong bond by moisture curing at
room temperature in less than a minute with contact
pressure.
• Light curing property: can be easily cured by irradiation
with light. Blushing can be also prevented by UV curing.
• Surfaces: will bond almost any combination of similar or
dissimilar materials.
• Easy Use: single component feature, eliminates any mixing.
• Due to low viscosity, it can penetrate gaps between
surfaces.
Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Dissipator® 319 features good thermal conductivity (1.1 W/mK to 1.4 W/mK)
Accelerator 48
Accelerator 48 is a solvent-based accelerator for instant adhesives. The accelerator is designed to speed the cure of Hernon cyanoacrylate adhesives. Accelerator 48 is used where increased cure speed of Hernon® cyanoacrylate adhesives is required. Especially recommended for applications involving printed circuit board wire tacking and tamper proofing of adjustable components.
Accelerator 52
Accelerator 52 is a single component, non-CFC solvent based adhesive accelerator formulated to promote the cure speed of Hernon cyanoacrylate adhesives.
Accelerator 58
Accelerator 58 is a single component non-CFC solvent-based product, formulated to provide a faster cure on acidic surfaces and cure excess Instantbond? cyanoacrylate adhesive outside the bond line. Accelerator 58 is used to increase the cure speed of Hernon® Instantbond® Adhesives. It is especially suited for post application on exposed Instantbond® adhesive outside of the bond line. Loudspeaker assembly and bonding jewelry are two examples.
Accurizer 76111
Accurizer 76111 is a single component U.V. anaerobic sealant. 76111 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet pull forces. Curing occurs when the adhesive is applied between mating surfaces. The cured adhesive is a thermoset plastic and endures exposure to most solvents. Ammunition Sealant 76111 cures quickly at room temperature without the need for surface activators or heat to seal primer and case mouth assemblies. Fixturing strength develops in two to three minutes, Full strength will be reached in 24 hours. Cure fillets at UV light irradiances above 100 milliwatts/cm² to insure proper cure.
Activator 15
Activator 15 is a solvent free product which was designed to be used with React® 727, 784 and Fusionbond 374.
Activator 21
Hernon Activator 21 is an encapsulated catalyst that activates the resin Self Locker 523.
Activator 45
Activator 45 is solvent-free and designed to initiate the cure of Hernon® toughened acrylic adhesives. Since Activator 45 contains no solvents, no waiting time for solvent evaporation is needed prior to assembly.
Activator 47
Activator 47 is solvent-free and designed to initiate the cure of Hernon toughened acrylic adhesives. Since Activator 47 contains no solvents, no waiting time for solvent evaporation is needed prior to assembly.
Activator 51
Activator 51 is a solvent-free product that is designed to initiate the cure of Hernon® toughened acrylic adhesives. Since Activator 51 contains no solvents, no waiting time for solvent evaporation is needed prior to assembly.
Activator 56
Activator 56 is a single component, non-CFC solvent-based product, designed to promote the cure speed of Hernon® Structural Adhesive/Sealants. Activator 56 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. Especially recommended for applications with passive metals, inert surfaces or where large gaps are present.
Activator 59
Activator 59 is a solvent-based product, specially formulated to promote the cure of Hernon Adhesives.
Activator 63
Activator 63 is a solvent-based product, specially formulated to promote the cure of Hernon Adhesives.
Adhesion Promotor 42
Adhesion Promoter 42 is a single component product designed to improve adhesion to low surface energy plastics such as polyethylene, polypropylene, and Santoprene to similar substrates using Quantum® and Instantbond® adhesives.
Ammunition Primer Sealant 34194
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate rapidly resulting in complete coverage of the gap. The fluorescent sealant will offer an easy inspection using standard vision system.
Blank Ammo Sealant 48641
Blank Ammunition Sealant 48641 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications.
Blank Ammo Sealant 48642
Blank Ammunition Sealant 48642 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications.
Blank Ammo Sealant 53162
Blank Ammunition Sealant 53162 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications.
Brake Bonder 362BB
Brake Bonder 362 is a black heat curing, nitrile/phenolic solvent-based adhesive. Cured Brake Bonder 362 furnishes excellent resistance to thermal shock, chemicals, and water. The cured bond withstands temperatures exceeding 600°F (315°C). The primary application for Brake Bonder 362 is bonding brake, clutch, and other friction materials to metal.
Bullet Proof 650
Bullet Proof 650 is an environmentally friendly, single component, room temperature cure sealant and coating material. Bullet Proof 650 is formulated to waterproof and seal the interface between a bullet and cartridge. Bullet Proof 650 coats the inside of large shells to prevent the corrosive attack by the cartridge on the ignition powder.
CA Remover 14
Cyanoacrylate Remover 14 is a specially formulated solvent to dissolve cured cyanoacrylate- based adhesives in between parts, clothing, or various surfaces. Remover 14 will allow the removal of cyanoacrylate adhesives in several minutes to several hours depending upon the amount of adhesive to be removed. Tissue or cloth saturated with Remover 14 will wipe off thin layers of adhesive. Larger beads or drops will require reapplication of the solvent. Bonded parts may require soaking.
Chemical Stripper 30
Chemical Stripper 30 is a chemical liquid that works to remove pre-cut conventional gasket cements as well as formed in place chemical gaskets. Chemical Stripper 30 lifts off baked-on gaskets, gasket cements, formed-in-place gaskets, carbon deposits, dried oil, grease and paint on any type of metal in minutes. Also suitable for use on wood. It is packaged in a convenient spray liquid that penetrates and cleans intricate shapes, but will not run off, even on vertical surfaces.
Cleaner 62
Cleaner 62 is a non-aqueous, hydrocarbon based, non-CFC industrial solvent which removes oil and grease completely. This cleaning solvent prepares the surface for bonding with Hernon® Adhesives and Sealants. Cleaner 62 is recommended for final cleaning prior to assembling parts with Hernon® Adhesives and Sealants. It is not recommended for cleaning (flushing) equipment or for cleaning printed circuit boards and printed circuit assemblies.
Copper Based Anti Seize 367
Copper Based Anti-Seize 367 is a low-friction, anti-seize lubricant manufactured from a combination of micro-size copper flakes and graphite dispersed in a water-resistant grease and fortified with antioxidants, plus rust and corrosion inhibitors. Copper Based Anti-Seize 367 provides a shield against metal-to-metal contact, preventing seizure and corrosion. It fills irregularities and imperfections and resists welding, hardening, or setting. Provides low friction and cushions impact and shock loads. Low shear between particles reduces stick-slip, allowing quick disassembly with minimum wrench torque. It will not squeeze out of the threads, gum up, or wash off.
Cylinlock® 34323
Cylinlock® 34323 is a fast curing, high-strength anaerobic adhesive yielding higher shear strengths with temperature resistance up to 300°F (149°C) It provides relatively quick cures, outstanding solvent resistance, and improved reliability for metal service applications.
Cylinlock® 42633
Cylinlock® 42633 is a fast curing, high strength anaerobic adhesive with temperature resistance up to 300°F (149°C). It is designed for the bonding of cylindrical fitting parts, particularly where bond gaps can approach 0.25 mm (0.01 in.) and where maximum strength at room temperature is required. Cylinlock® 42633 provides relatively quick cures, outstanding solvent resistance, and improved reliability for severe service applications.
Cylinlock® 52631
Cylinlock® 52631 is a single component, anaerobic retaining adhesive designed for the bonding of cylindrical parts. The product cures when confined in the absence of air between close-fitting metal surfaces.
Cylinlock® 820
UV Curable Cylinlock® 820 is a fast curing, high-strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents. Augments or replaces press fits, set screws, pins and other mechanical retaining methods. Avoids heavy press fits due to rapid cure. Cylinlock® 820 cures quickly at room temperature without the need for surface activators or heat to join cylindrical assemblies. Fixturing strength develops in five minutes or within 15 seconds by exposing the edge fillets to high intensity long wavelength UV light (365 nm). Full strength will be reached in 24 hours.
Cylinlock® 821
UV Curable Cylinlock® 821 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents and withstands temperatures up to 300°F (149°C). Augments or replaces press fits, set screws, pins and other mechanical retaining methods. Avoids heavy press fits due to rapid cure. Cylinlock® 821 cures quickly at room temperature without the need for surface activators or heat to join cylindrical assemblies. Fixturing strength develops in five minutes, or within 15 seconds by exposing the edge fillets to high intensity long wavelength UV light (365 nm). Full strength will be reached in 24 hours.
Cylinlock® 822
Cylinlock® 822 is a high performance, single component, 100% active anaerobic adhesive/sealant formulated for dependable bonding of fitted cylindrical parts. Cylinlock® 822 offers high strength as well as superior heat and chemical resistant bonding at room temperature. Cylinlock® 822 is formulated for applications, which require superior strength with temperature resistance up to 300°F (149°C).
Cylinlock® 823
Cylinlock® 823 is a single-component, anaerobic retaining adhesive designed for the bonding of cylindrical parts. The product cures when confined in the absence of air between close-fitting metal surfaces.
Cylinlock® 824
Cylinlock® 824 is a general purpose, single-component, anaerobic adhesive used primarily for joining cylindrical assemblies of all types. It is a low viscosity, self-hardening adhesive that cures when confined between ferrous or copper alloy metals. The cured adhesive is a thermoset plastic suitable for exposure to most solvents.
Cylinlock® 826
Cylinlock® 826 is a single component high temperature anaerobic resin used for bonding rigid assemblies of all types. It also can be used effectively to increase the strength of most mechanical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents.
Cylinlock® 827
Cylinlock® 827 is a single component anaerobic retaining adhesive for cylindrical joints. The product cures when confined in the absence of air between close fitting metal surfaces. This product develops medium strength to facilitate disassembly.
Cylinlock® 842
Cylinlock® 842 is a high temperature, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents.
Cylinlock® 843
Cylinlock® 843 is a fast curing, high strength anaerobic adhesive yielding higher shear strengths with temperature resistance up to 300°F (149°C) It provides relatively quick cures, outstanding solvent resistance, and improved reliability for metal service applications. Flexible and good for use on Brass.
Cylinlock® 844
Cylinlock® 844 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents and withstands temperatures of 300°F (150°C). Augments or replaces press fits, set screws, pins and other mechanical retaining methods.
Cylinlock® 845
Cylinlock® 845 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents and withstands temperatures of 300°F (149°C). Hernon Cylinlock® 845 cures quickly at room temperature without the need for surface activators or heat to join cylindrical assemblies. Fixturing strength develops in 24 hours. Hernon Primer 49 or 50 can be used to reduce fixturing time on inactive surfaces and to increase cure through gap. Certified to NSF/ANSI Standard 61 for use in commercial and residential potable water systems
Cylinlock® 846
Cylinlock® 846 is a fast-curing, high-strength anaerobic adhesive yielding higher shear strengths with temperature resistance up to 300°F (149°C). It provides relatively quick cures, outstanding solvent resistance, and improved reliability for metal service applications. Certified to NSF/ANSI Standard 61 for use in commercial and residential potable water systems.
Cylinlock® 847
Cylinlock® 847 is a high temperature, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents.
Cylinlock® 94953
Cylinlock® 94953 is a high-temperature, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents.
Dissipator® 745
Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
Dissipator® 746
Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.
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