High-Performance Epoxy Adhesives from a Leading Epoxy Adhesive Manufacturer
As a trusted epoxy adhesive manufacturer, Hernon Manufacturing offers a wide range of epoxies in both single and two-component formulations to meet your exact bonding needs. Two-component epoxies are chemically curing materials with two separate components—one serving as an adhesive and the other as a chemical initiator. These epoxies rarely require batch mixing and are typically dispensed using static mixing wands from preformed duo-part packages, ensuring a perfect dispensing ratio each time.
Single-component epoxies, on the other hand, are heat-cure adhesives that require a certain temperature to initiate the crosslinking (curing) reaction. Whether you need fast room temperature cure epoxies or low-chlorine formulations, Hernon Manufacturing provides tailored solutions to meet diverse industry needs.
With a library of over 5,000 unique adhesives and sealants, including custom-made formulations, Hernon offers comprehensive support in bonding even the rarest combinations of substrates in any environment.
Significant Features and Key Advantages of Hernon Manufacturing Epoxy Adhesives:
Reduced cost per application compared to alternative fastening methods
Diffuses stress across the entire bonded surface
Bonds using lightweight polymers for improved performance
100% Active – No solvents
Seals and fills gaps while bonding
Water and chemical resistance for durability
Prevents corrosion of bonded assemblies
Apply across the entire bonding surface in one step
Custom formulas available, including UV curing epoxies
Explore our range of epoxy adhesives and discover why Hernon Manufacturing is a leader among epoxy adhesives manufacturers in providing customized solutions for any application. Contact us today to discuss your needs with our experts!
Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 302 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 304 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 310 adhesive/sealant is a two-component epoxy, 100% solid system, two to one ratio, room temperature cure system. Tuffbond® 310 is recommended for bonding metals, wood, and ceramics.
Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 318 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 318 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 318 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
Tuffbond® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy was commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and the need for equipment flushing solvents have made Tuffbond® 394 more practical.
Tuffbond® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. Tuffbond® 42121 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 65891 is a two-component, room temperature cure system. Tuffbond® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
