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    Tuffbond® 302

    Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 302 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 304

    Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 304 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 305

    Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 310

    Tuffbond® 310 adhesive/sealant is a two-component epoxy, 100% solid system, two to one ratio, room temperature cure system. Tuffbond® 310 is recommended for bonding metals, wood, and ceramics.
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    Tuffbond® 312

    Tuffbond® 312 is a slow curing epoxy adhesive. Epoxy system has 2 components which need to be mixed well.
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    Tuffbond® 313

    Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 315

    Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 316

    Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 317

    Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 318

    Tuffbond® 318 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 318 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 318 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 321

    Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
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    Tuffbond® 3661

    Tuffbond® 3661 is a unique room temperature curing, two component epoxy-containing adhesive for high temperature bonding and potting applications. It is formulated to cure at room temperature, with a convenient mixing ratio of 1:1. Tuffbond® 3661 produces high strength bonds whose strength is maintained even after long exposure to temperatures in the 250° to 300°F range.
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    Tuffbond® 394

    Tuffbond® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy was commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and the need for equipment flushing solvents have made Tuffbond® 394 more practical.
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    Tuffbond® 42121

    Tuffbond® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. Tuffbond® 42121 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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    Tuffbond® 47771

    Tuffbond® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system.
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    Tuffbond® 58761

    Tuffbond® 58761 adhesive/sealant is a two component, 100% solid system, one-to-one ratio, room temperature cure system.
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    Tuffbond® 65891

    Tuffbond® 65891 is a two-component, room temperature cure system. Tuffbond® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
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