Activator 63

Instantbond® 110 is a state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond® 110 develops handling strength within seconds and full functional strength in a few hours. Instantbond® 110 can bond a wide variety of surfaces including thermoplastics, elastomers, ceramics, leather, cork, and paper, but is particularly suited for bonding metal substrates. Notwithstanding the superior bonding capability of Instantbond® 110, it is NOT recommended for long-term glass to glass bonding applications.

Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.

Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.