Nuts N' Bolts® 427

Fusionbond® 371 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond® 371 is an excellent choice for composite bonding applications in the marine, automotive and construction industries because it requires virtually no surface preparation. Fusionbond® 371 provides toughness at temperatures from -67 to 250°F.

Instantbond® 117 is a high viscosity, state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond® 117 develops handling strength within seconds and full functional strength in a few hours. Instantbond® 117 can bond a wide variety of surfaces including metals, thermoplastics, elastomers, ceramics, leather, cork, and paper, but is particularly suited for wire tacking applications. Notwithstanding the superior bonding capability of Instantbond® 117, it is NOT recommended for long-term glass to glass bonding applications.

Nuts N' Bolts® 434 is a thixotropic, 100% active anaerobic compound which solidifies with reliable and expected strength upon application to most fasteners. Particularly suitable for applications on less active substrates such as stainless steel and plated surfaces, where disassembly with hand tools is required for servicing. Nuts N' Bolts® 434 is easily applied. No mixing (single component), no curing outside the joint and no torque adjustments are necessary. Nuts N' Bolts® 434 offers increased profitability, having approximately 80% cost advantage over the cheapest mechanical methods as well as reducing inventories, maintenance, and the need for costly precision tolerances. Nuts N' Bolts® 434 can be used on up to 3/4inch bolts with light oil contamination.

Ultrabond® 758 Is a low viscosity self-leveling UV curable potting compound formulated to provide high performance, fast curing, coating and encapsulating of electronic components. This product is also used for shallow potting applications.