Formulations

External Ammunition Sealant 76021 is a single component U.V. anaerobic sealant.

Hernon® Fusionbond® 3751-10 is two-component methacrylate adhesive designed for room-temperature curing with a 1:1 mix ratio. This next-generation formula offers enhanced stability when stored at room temperature. Fusionbond® 3751-10 achieves fixture strength within 10 minutes and provides durable performance across a wide temperature range of -67°F to 250°F. Engineered for versatility, Fusionbond® 3751-10 bonds a variety of substrates with minimal surface preparation. Recommended substrates include various metals, PVC, acrylic, ABS, and fiberglass. Product Features •Non-sagging gaps filled to 0.125 inch. •Superior impact and peel strength •Minimal or no surface preparation •Rapid room temperature cure •100% reactive •Excellent environmental and chemical resistance •Gasoline resistance

Hernon® Fusionbond® 3770-15 is a high-performance, two-component methacrylate adhesive that cures at room temperature with a 1:1 mix ratio. Engineered with advanced technology, this next-generation formula delivers strong, durable bonds while significantly reducing odor. Fusionbond® 3770-15 offers a working life of 15 to 20 minutes. Once cured, it delivers durable performance across a broad temperature range of -67°F to 250°F. Designed for versatility, Fusionbond® 3770-15 effectively bonds a wide range of substrates such as various metals and some plastics such as acrylic and fiberglass. Product Features: •Formula fills gaps up to 0.125 inches •High shear strength with high resistance to environmental factors •Low odor formula

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application