Formulations

Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.

Dripstop® 920 is a general-purpose anaerobic pipe sealant which contains Teflon®. It has superior sealing and mild locking performance compared to tapes and non-hardening dopes. The properties of this Dripstop® prevents galling on Stainless Steel, Aluminum, and other metal pipe fittings. Dripstop® 920 reduces costs by eliminating leakage and increasing the assembly line speed. Dripstop® 920 seals to moderate pressure immediately and to 250 psig steam pressure in just 24 hours. This sealant also lubricates threads during make-up, prevents galling and assures smooth disassembly. UL Classification – File MH14222 Classified by Underwriters Laboratories Inc.® as to fire hazard only. 920 Pipe Sealant with Teflon®. Fire hazard is small. No flash point in liquid state. Ignition temperature 455°C (851°F). For use in devices handling gasoline, petroleum oils, natural gas (pressure not to exceed 300 psig), butane and propane not exceeding 2 in. pipe size. 29R9.

Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical Applications Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application

Hernon® 525 is a pre-applied, micro-encapsulated adhesive for threaded fasteners. Hernon® 525 stays on the bolt until the shearing action of an engaging nut applied to the coated bolt causes the capsules to break allowing the adhesive to cure. This material securely locks and seals against vibration loosening and fluid leakage. Typical Applications Locking & Sealing: • Head bolts • Truck Axle bolts • Transmission nuts • Pipe plugs and fittings Product Benefits • Improves reliability. • Prevents loosening of bolts due to vibration. • Seals against leakage. • Prevents threads from corroding. • Easily visible for inspection. • Pre-coated parts can be packaged and shipped in normal fashion. • Excellent solvent resistance. •Bonds to stainless steel bolts.

Hernon® HPS Activator 4322 is used to activate Hernon® Hernon Porosity Sealant (HPS) resins. HPS resins cures to form a thermoset polymer when exposed to elevated temperature. Thermal content and coefficient of thermal transfer in the workpieces influence the cure rate of the HPS system. Higher temperatures produce quicker cure rates. HPS resins generally cures within the range of 177°F (80°C) to 205°F (96°C). Proper cure requires the workpiece to uniformly attain full cure temperature. Parts that do not transfer heat well will required longer processing times. Efficient thermal conductivity yields shorter processing cycles. Parts with heavier cross sections require longer exposure at heat to attain sufficient temperature internally. Carefully consider part geometry. Consult Hernon® Technical Service for specific process requirements.