Formulations

Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Silastomer® 336 is a high performance, single component, acetoxy, ready to use silicone. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer® 336 can be applied to vertical, horizontal and overhead joints without sagging or running off. It will adhere to clean metals, glass, most types of wood, silicone resin, vulcanized silicone rubber, natural and synthetic fiber, ceramic, many plastics and painted surfaces. Silastomer® 336 provides excellent resistance to moisture, weathering, vibration, ozone and extreme temperatures. It can be applied in surface temperatures of 0°F to above 120°F with no loss in performance. Fully cured Silastomer® 336 can withstand extended periods at temperatures up to 400°F.

Nuts N’ Bolts® 429 is a single component anaerobic thread locking adhesive. Nuts N’ Bolts® 429 is a high-strength adhesive for locking and sealing large bolts and studs 1inch and larger diameters. Curing occurs only when adhesive is confined between mating surfaces. The cured adhesive is suitable for temperatures up to 300°F (149°C) and exposure to most solvents.

Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical Applications Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application

Hernon® 525 is a pre-applied, micro-encapsulated adhesive for threaded fasteners. Hernon® 525 stays on the bolt until the shearing action of an engaging nut applied to the coated bolt causes the capsules to break allowing the adhesive to cure. This material securely locks and seals against vibration loosening and fluid leakage. Typical Applications Locking & Sealing: • Head bolts • Truck Axle bolts • Transmission nuts • Pipe plugs and fittings Product Benefits • Improves reliability. • Prevents loosening of bolts due to vibration. • Seals against leakage. • Prevents threads from corroding. • Easily visible for inspection. • Pre-coated parts can be packaged and shipped in normal fashion. • Excellent solvent resistance. •Bonds to stainless steel bolts.

Hernon® HPS Activator 4322 is used to activate Hernon® Hernon Porosity Sealant (HPS) resins. HPS resins cures to form a thermoset polymer when exposed to elevated temperature. Thermal content and coefficient of thermal transfer in the workpieces influence the cure rate of the HPS system. Higher temperatures produce quicker cure rates. HPS resins generally cures within the range of 177°F (80°C) to 205°F (96°C). Proper cure requires the workpiece to uniformly attain full cure temperature. Parts that do not transfer heat well will required longer processing times. Efficient thermal conductivity yields shorter processing cycles. Parts with heavier cross sections require longer exposure at heat to attain sufficient temperature internally. Carefully consider part geometry. Consult Hernon® Technical Service for specific process requirements.