Formulations

Primer 49 is a single component, non-CFC solvent based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 49 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. It is particularly recommended for cure conditions below 15°C. Primer 49 meets the requirements of MIL-S-22473E (Grade T) and ASTM D5363 (Grade T).

Tuffbond® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy was commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and the need for equipment flushing solvents have made Tuffbond® 394 more practical.

Rust Eliminator 32 is a new revolutionary product for eliminating old rust and preventing new rust on steel parts. Rust is chemically transformed into an inert, non-corrosive coating.

Primer 50 is a single component, non-CFC solvent-based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 50 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. It is particularly recommended for cure conditions below 15°C. Primer 50 meets the requirements of ASTM D5363 (Grade N) and MIL-S-46163A Grade F.

Tuffbond® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 395 will change from amber to a reddish brown upon cure. Bonding the voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200°F (93°C). Two component epoxy systems have been most commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and static mixers and the need for equipment flushing solvents have made Tuffbond® 395 more practical.

DEACTIVATOR FOR UV FOG, 500 GRAMS

LT YELLOW-AMBER, 1 LITER

CM8005 is a single-component room temperature cure gel-like anaerobic gasketing compound formulated to provide instant sealing capabilities. Once cured between mating metal flanges and filling voids in the surface, CM8005 provides a thin, flexible, solvent and temperature resistant seal.

Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Nuts N’ Bolts® 423 is a single component anaerobic thread locking material, which is thixotropic and develops medium strength. The product cures when confined in the absence of air between close fitting metal surfaces and is particularly suitable for less active substrates such a stainless steel and plated surfaces.

Ultrabond® 3444 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond® 3444 is excellent for bonding and tacking many parts. Ultrabond® 3444 can also be cured with heat above 200°F (93°C) or Activator 56. Exposure to a high intensity UV light will cure these adhesives to a dry, hard surface.

Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical Applications Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application

Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product Benefits • High temperature resistance. • Single component (no mixing, no pot life). • Contains 150micron spacer beads for bond line control • Solventless. • Cures on demand (heat cure). • Will not slip during cure. • Changes color upon cure (yellow to brown). • Excellent adhesion to various substrates. • Gives high shear. • Low water absorption.

Hernon® Ultrabond® 750 is a UV curable adhesive that can be used to seal a variety of plastics when exposed to UV light. The sealant offers a water- tight seal with excellent environmental resistance. Prevents material escaping through a crimped seal. With Ultrabond 750 a low powered UV lamp (Blacklight), can be used to inspect for the presence of adhesive on the substrates. Product Benefits • UV fluorescence for in-process inspection •Cures well at 395nm •Flexible thermoset system • Excellent Water Resistance •Good adhesion to a variety of plastics • 100% solid system (no solvents) • Good gap filling properties • No shrinkage due to solvent evaporation • Rapid UV cure

Hernon® 525 is a pre-applied, micro-encapsulated adhesive for threaded fasteners. Hernon® 525 stays on the bolt until the shearing action of an engaging nut applied to the coated bolt causes the capsules to break allowing the adhesive to cure. This material securely locks and seals against vibration loosening and fluid leakage. Typical Applications Locking & Sealing: • Head bolts • Truck Axle bolts • Transmission nuts • Pipe plugs and fittings Product Benefits • Improves reliability. • Prevents loosening of bolts due to vibration. • Seals against leakage. • Prevents threads from corroding. • Easily visible for inspection. • Pre-coated parts can be packaged and shipped in normal fashion. • Excellent solvent resistance. •Bonds to stainless steel bolts.

Hernon® External Ammunition Sealant 76984 is a single component high strength U.V. anaerobic sealant. 76984 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet pull forces. Curing occurs when the adhesive is applied between mating surfaces. The cured adhesive is a thermoset plastic and endures exposure to most solvents. Ammunition Sealant 76984 cures quickly at room temperature without the need for surface activators or heat to seal primer and case mouth assemblies. Fixturing strength develops in two to three minutes, Full strength will be reached in 24 hours. Cure fillets at UV light irradiances above 100 milliwatts/cm² to insure proper cure. Product Benefits • UV fluorescence for in-process inspection • 100% solid system (no solvents) • Excellent environmental resistance • Good gap filling properties • Excellent Bullet Pull strengths with low Standard deviation. • UV and anaerobic curing mechanism suitable for metal parts • Good capillary performance

Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.

Hernon® HPS Activator 4322 is used to activate Hernon® Hernon Porosity Sealant (HPS) resins. HPS resins cures to form a thermoset polymer when exposed to elevated temperature. Thermal content and coefficient of thermal transfer in the workpieces influence the cure rate of the HPS system. Higher temperatures produce quicker cure rates. HPS resins generally cures within the range of 177°F (80°C) to 205°F (96°C). Proper cure requires the workpiece to uniformly attain full cure temperature. Parts that do not transfer heat well will required longer processing times. Efficient thermal conductivity yields shorter processing cycles. Parts with heavier cross sections require longer exposure at heat to attain sufficient temperature internally. Carefully consider part geometry. Consult Hernon® Technical Service for specific process requirements.

Fusionbond® 3780-05 is a high-performance, two-component methacrylate adhesive that cures at room temperature with a 1:1 mix ratio. Engineered with advanced technology, this next-generation formula delivers strong, durable bonds while significantly reducing odor for improved user experience. Fusionbond® 3780-05 offers a working life of 5 to 10 minutes. Once cured, it delivers durable performance across a broad temperature range of -67°F to 250°F. Designed for versatility, Fusionbond® 3780-05 effectively bonds a wide range of substrates such as various metals and some plastics such as acrylic and fiberglass. Product Features: • Formula fills gaps up to 0.125 inches • High shear strength with high resistance to environmental factors • Low odor formula