Formulations

Dripstop® 912 provides maximum solvent resistance on threaded fittings and pipe up to 3” in diameter. It is recommended for refrigeration systems and service with strong chemicals. Dripstop® 912 is not for slip fitted tube joints. Dripstop® 912 has excellent solvent resistance and withstands temperatures to 300°F (149°C). This product is not recommended for use on plastic piping.

Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.

Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical Applications Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components. Product Benefits • No mixing required (eliminates errors in mixing ratio) • Room temperature cure. No heat required. • Eliminates screws and rivets for assembly. • Eliminates the air space between components. • High k factor for heat conductive application

Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Dissipator® 319 features good thermal conductivity (1.1 W/mK to 1.4 W/mK)

Cylinlock® 94953 is a high-temperature, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents.

Cylinlock® 847 is a high temperature, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents.

Cylinlock® 846 is a fast-curing, high-strength anaerobic adhesive yielding higher shear strengths with temperature resistance up to 300°F (149°C). It provides relatively quick cures, outstanding solvent resistance, and improved reliability for metal service applications. Certified to NSF/ANSI Standard 61 for use in commercial and residential potable water systems.

Cylinlock® 845 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents and withstands temperatures of 300°F (149°C). Hernon Cylinlock® 845 cures quickly at room temperature without the need for surface activators or heat to join cylindrical assemblies. Fixturing strength develops in 24 hours. Hernon Primer 49 or 50 can be used to reduce fixturing time on inactive surfaces and to increase cure through gap. Certified to NSF/ANSI Standard 61 for use in commercial and residential potable water systems

Cylinlock® 844 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents and withstands temperatures of 300°F (150°C). Augments or replaces press fits, set screws, pins and other mechanical retaining methods.

Cylinlock® 843 is a fast curing, high strength anaerobic adhesive yielding higher shear strengths with temperature resistance up to 300°F (149°C) It provides relatively quick cures, outstanding solvent resistance, and improved reliability for metal service applications. Flexible and good for use on Brass.

Cylinlock® 842 is a high temperature, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. This compound will cure on metallic or non-metallic substrates and is suitable for exposure to most solvents.

Cylinlock® 827 is a single component anaerobic retaining adhesive for cylindrical joints. The product cures when confined in the absence of air between close fitting metal surfaces. This product develops medium strength to facilitate disassembly.

Cylinlock® 824 is a general purpose, single-component, anaerobic adhesive used primarily for joining cylindrical assemblies of all types. It is a low viscosity, self-hardening adhesive that cures when confined between ferrous or copper alloy metals. The cured adhesive is a thermoset plastic suitable for exposure to most solvents.

Cylinlock® 822 is a high performance, single component, 100% active anaerobic adhesive/sealant formulated for dependable bonding of fitted cylindrical parts. Cylinlock® 822 offers high strength as well as superior heat and chemical resistant bonding at room temperature. Cylinlock® 822 is formulated for applications, which require superior strength with temperature resistance up to 300°F (149°C).

UV Curable Cylinlock® 821 is a fast curing, high strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents and withstands temperatures up to 300°F (149°C). Augments or replaces press fits, set screws, pins and other mechanical retaining methods. Avoids heavy press fits due to rapid cure. Cylinlock® 821 cures quickly at room temperature without the need for surface activators or heat to join cylindrical assemblies. Fixturing strength develops in five minutes, or within 15 seconds by exposing the edge fillets to high intensity long wavelength UV light (365 nm). Full strength will be reached in 24 hours.

UV Curable Cylinlock® 820 is a fast curing, high-strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents. Augments or replaces press fits, set screws, pins and other mechanical retaining methods. Avoids heavy press fits due to rapid cure. Cylinlock® 820 cures quickly at room temperature without the need for surface activators or heat to join cylindrical assemblies. Fixturing strength develops in five minutes or within 15 seconds by exposing the edge fillets to high intensity long wavelength UV light (365 nm). Full strength will be reached in 24 hours.

Cylinlock® 52631 is a single component, anaerobic retaining adhesive designed for the bonding of cylindrical parts. The product cures when confined in the absence of air between close-fitting metal surfaces.

Cylinlock® 42633 is a fast curing, high strength anaerobic adhesive with temperature resistance up to 300°F (149°C). It is designed for the bonding of cylindrical fitting parts, particularly where bond gaps can approach 0.25 mm (0.01 in.) and where maximum strength at room temperature is required. Cylinlock® 42633 provides relatively quick cures, outstanding solvent resistance, and improved reliability for severe service applications.

Cylinlock® 34323 is a fast curing, high-strength anaerobic adhesive yielding higher shear strengths with temperature resistance up to 300°F (149°C) It provides relatively quick cures, outstanding solvent resistance, and improved reliability for metal service applications.